MECHFORUM2023

June 08-10, 2023, Hybrid

Abstract Submission Registration
Welcome Note By Conference Chair About the Conference

Dear Colleagues,

It is with great pleasure that we welcome all the researchers in the field of Automotive and Mechanical Engineering to the International Forum on Automotive and Mechanical Engineering (MECHFORUM2023), which will be held in Osaka, Japan during June 08-10, 2023.

The aim of MECHFORUM2023 is to be a premier international forum to highlight novel developments, share new ideas, research results, and development experiences, and provide networking opportunities with peers to help establish connections for early-career scientists to meet a diverse mix of researchers, decision-makers to strengthen existing connections and forge new ones.

Also, the main agenda of this conference is to bring together world-leading academics, practitioners, industry leaders, policymakers, and business professionals from the fields of Mechanical Engineering to develop practical solutions for current challenges in these fields. The conference series has featured plenary talks, keynote talks, special sessions, poster presentations, workshops, and contributed papers each year.

We do hope you can make time in your busy schedule to the meeting and share your ideas on a topic of your choice and be a part of this successful conference.

We are looking forward to seeing you in Osaka, Japan.


Welcome to the International Forum on Automotive and Mechanical Engineering (MECHFORUM2023)!

During last three years, the automotive industry has experienced an abrupt paradigm shift to electric cars and the adaptation of AI technology has brought great innovation in mechanical engineering, while COVID-19 pandemic has postponed numerous academic events, including this forum. By recovering the unprecedented challenges caused by the COVID-19, we are pleased to finally convene the MECHFORUM2023 and bring together our distinguished guests, speakers, participants, and sponsors, to share our latest results of research and developments.

Automotive and mechanical engineering is an ever-evolving fundamental engineering field that drives innovative progress in diverse industries. In this forum, many scholars, researchers, and engineers will be participated to discuss and exchange their ideas about the latest advances in the fields. This forum might provide an exceptional opportunity to establish global networks with fellow professionals, make new partnerships with reinforcing existing ones. The plenary and invited talks, and technical sessions will serve as a platform to explore the most recent trends, challenges, and breakthroughs in emerging technologies in the automotive and mechanical engineering.

I would like to express my sincere appreciation to the organizing committee, whose dedication and hard working have made this forum possible. Their efforts have contributed to make this event as safe and productive one. As we emerge from the COVID-19 pandemic, we need to get together for restarting our collective exchange in knowledge and experience to advance the field of automotive and mechanical engineering, push innovative technologies, and tackles the global challenges that confront us. Please utilize this forum to reignite our enthusiasm on automotive and mechanical engineering, and embark upon novel collaborations and partnerships. I wish all participants to have a productive and enjoyable time at the International Forum on Automotive and Mechanical Engineering (MECHFORUM2023).

Best Regards,

Prof. Sang Joon Lee
Pohang University,Korea
Honorable Chair
MECHFORUM2023.

Important Dates

Abstract Submission Deadline

May 08, 2023

Earlybird Registration

April 28, 2023

Standard Registration

May 08, 2023

On-spot Registration

June 08, 2023

Plenary Speakers

S A Sherif
S A Sherif

University of Florida
USA

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Ali Erdemir
Ali Erdemir

Texas A&M University
USA

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William Singhose
William Singhose

Georgia Institute of Technology
USA

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Weidong Zhu
Weidong Zhu

University of Maryland
USA

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Dan Zhang
Dan Zhang

York University
Canada

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Chua Kian Jon
Chua Kian Jon

National University of Singapore
Singapore

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Sang Joon LEE
Sang Joon LEE

Pohang University
Korea

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Jun Li
Jun Li

Curtin University
Australia

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Xingjian Jing
Xingjian Jing

City University of Hong Kong
Hong kong

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Khalid Sorensen
Khalid Sorensen

Finity Engineering LLC
USA

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Keynote Speakers

Len Gelman
Len Gelman

University of Huddersfield
United Kindom

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James Xiaoyu Gao
James Xiaoyu Gao

University of Greenwich
United Kingdom

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Zhengbao YANG
Zhengbao YANG

City University of Hong Kong
Hong Kong

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Roozbeh Dargazany
Roozbeh Dargazany

Michigan State University
United States

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Xuexi Zhang
Xuexi Zhang

Harbin Institute of Technology
China

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Junfeng Zhang
Junfeng Zhang

Laurentian University
Canada

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Invited Speakers

Zhaoye Qin
Zhaoye Qin

Tsinghua University
China

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Maki K Habib
Maki K Habib

The American University in Cairo
United States

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Codina Movileanu
Codina Movileanu

Ilie Murgulescu Institute of Physical Chemistry
Romania

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Shameer Khader
Shameer Khader

Imperial college London
United States

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Libor Pekar
Libor Pekar

Tomas Bata University
Czech Republic

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Ye Ai
Ye Ai

Singapore University of Technology and Design
Singapore

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Hocine Imine
Hocine Imine

The Versailles University
France

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Yingjia Zhang
Yingjia Zhang

Xi'an Jiaotong University
China

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Wei Min Huang
Wei Min Huang

Nanyang Technological University
Singapore

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Paul Grunow
Paul Grunow

Trinity Solarbeteiligungen GmbH
Germany

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Hao Wang
Hao Wang

National University of Singapore
Singapore

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Quanmin Zhu
Quanmin Zhu

University of the West of England
United Kindom

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Elsayed Ahmed Elnashar
Elsayed Ahmed Elnashar

Kafrelsheikh University
Egypt

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Madjid Soltani
Madjid Soltani

University of Waterloo
Canada

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Astrid Forneck
Astrid Forneck

University of Natural Resources and Life Sciences Vienna
Austria

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Seyed Mohsen Hosseini
Seyed Mohsen Hosseini

University of Bozen-Bolzano
Italy

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Abeer Al Anazi
Abeer Al Anazi

Australian University
Kuwait

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Yanming Zhang
Yanming Zhang

University of Tokyo
Japan

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Boscoianu Mircea
Boscoianu Mircea

Transilvania University
Romanian

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Miguel F. Arevalo-Castiblanco
Miguel F. Arevalo-Castiblanco

Universidad Nacional de Colombia
Colombia

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Gengxiang Wang
Gengxiang Wang

Xi'an University of Architecture and Technology
China

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Shiwei Zhou
Shiwei Zhou

RMIT University
Australia

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Van Tu Nguyen
Van Tu Nguyen

Pusan National University
Korea

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Chuanqi Liu
Chuanqi Liu

Chinese Academy of Sciences
China

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Yuval Cohen
Yuval Cohen

Tel-Aviv Afeka College of Engineering
Israel

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Haifeng Ma
Haifeng Ma

Shandong University
China

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Yang XU
Yang XU

Harbin Institute of Technology
China

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Chenlin Li
Chenlin Li

Lanzhou Jiaotong University
China

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Xing Fu
Xing Fu

Dalian University of Technology
China

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Jinglong Chen
Jinglong Chen

Xi'an Jiaotong University
China

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Jianxun Zhang
Jianxun Zhang

Xi'an Jiaotong University
China

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Xianjian Jin
Xianjian Jin

Shanghai University
China

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Hsueh-Shih Chen
Hsueh-Shih Chen

National Tsing Hua University
Taiwan

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Hengyun Zhang
Hengyun Zhang

Shanghai University
china

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Zhongwei Huang
Zhongwei Huang

China University of Petroleum
China

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Juan Jose Encinas C
Juan Jose Encinas C

Ricardo Palma University
Peru

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Jiashun Guo
Jiashun Guo

Chang'an University
China

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Sessions

  • Mechanical Engineering
  • Automotive Engineering
  • Statics and Dynamics
  • Materials Engineering, Composites
  • Thermodynamics
  • Manufacturing Engineering
  • Additive Manufacturing and Reverse Engineering
  • Robotics and Automation
  • Vehicle Aerodynamics
  • Alternative Power Systems and Management
  • Design and Manufacturing
  • Heat and Mass Transfer
  • Industrial Tribology
  • Instrumentation and Control
  • Mechatronics
  • MEMS and Nanotechnology
  • Noise Vibration & Harshness
  • Optimization of Systems
  • Green Manufacturing
  • Renewable/Non-Renewable Energies

Tentative Schedule

Day 1

Time Session
08:30 - 09:00 Registrations
09:00 - 09:30 Opening Words
09:30 - 10:45 Plenary Presentations
10:45 - 11:00 Group Photography followed by Snacks Break
11:00 - 13:00 Plenary Presentations
13:00 - 14:00 Lunch Break
14:00 - 15:50 Invited Presentations
15:50 - 16:05 Evening Break and Networking
16:05 - 17:30 Invited Presentations

Day 2

Time Session
09:00 - 09:30 On-Spot Registrations
09:30 - 10:55 Plenary Presentations
10:55 - 11:10 Tea/Coffee & Snacks Break
11:10 - 12:50 Keynote Presentations
12:50 - 13:50 Lunch Break
13:50 - 14:50 Hands on Workshop
14:50 - 16:00 Speaker Presentations
16:00 - 16:15 Evening Break and Networking
16:15 - 17:30 Speaker Presentations

Day 3

Time Session
09:00 - 09:30 On-Spot Registrations
09:30 - 10:55 Speaker Presentations
10:55 - 11:10 Tea/Coffee & Snacks Break
11:10 - 12:50 Speaker Presentations
12:50 - 13:50 Lunch Break
13:50 - 16:15 Poster Presentations
16:15 - 16:45 Presenations & Awards
16:45 - 17:00 Closing Cermony

Event Venue

Hybrid

Osaka is located on the main island of Honshu, roughly in the center of Japan. Osaka City, which was incorporated in 1889, has a population of 2.5 million and an area of 221 square kilometers. Osaka Prefecture, which includes Osaka City (its capital) and 42 other municipalities, has a population of 8.7 million and a total land mass of about 1,905 square kilometers. Although Osaka is Japan's second smallest prefecture by size, its population represents 7% of the entire nation, making it the second most populous prefecture after Tokyo. Furthermore, 10% of all non-Japanese residents live in Osaka.

Historical Overview:

1400 Years of Tradition

Since ancient times, Osaka has been a gathering place. Located at the confluence of a vast web of busy river and sea routes, it naturally grew into a flourishing economic center and became the gateway to Japan for travelers and traders from all over Asia.



Registration

Speaker Registration
$ 749

  • Access to all Conference Sessions
  • Opportunity to give a Keynote/ Plenary/ Workshop
  • Participation Certificate Accredited by our Organizing Committee Member
  • Tea/Coffee & Snack, Lunch during the Conference

Delegate Registration
(No Presentation)
$899

  • Access to all Conference Sessions
  • Participation Certificate Accredited by our Organizing Committee Member
  • Delegates are not allowed to present their papers in Oral or Poster sessions
  • Tea/Coffee & Snack, Lunch during the Conference

Poster
$ 449

  • Access to all Conference Sessions
  • Opportunity to give an Oral/ Poster Presentation
  • Participation Certificate Accredited by our Organizing Committee Member
  • Tea/Coffee & Snack, Lunch during the Conference

Student Delegate/Listener
$ 299

  • Access to all Conference Sessions
  • Opportunity to give an Oral/ Poster Presentation
  • Participation Certificate Accredited by our Organizing Committee Member
  • Tea/Coffee & Snack, Lunch during the Conference